Solidigm SSD Solutions Span Both Air-Cooled and Fully Liquid-Cooled Architectures for Next-Generation AI Systems
Rancho Cordova, Calif., March 16, 2026 – Solidigm, a pioneer in enterprise data storage, is touting this week at the GTC AI Conference the benefits of its enterprise solid state drives (eSSDs) for optimized AI data infrastructure.
Solidigm is showcasing next-generation SSD solutions optimized for AI server environments spanning both air-cooled and fully liquid-cooled architectures. The Solidigm drives highlight how SSD innovation enables 100 percent liquid-cooled designs and unlocks higher density, improved thermals, and scalable performance for next-generation AI systems.
First demonstrated at the GTC AI Conference in 2025 and introduced for customers last September, the SolidigmTM D7-PS1010 E1.S SSD is the industry’s first eSSD with single-sided direct-to-chip liquid cooling technology and among the fastest PCIe 5.0 SSD on the planet for Direct Attach Storage (DAS) AI workloads.
“Solidigm’s direct-to-chip liquid-cooled eSSD enables data center and edge operators to realize impactful space savings—opening the door for unprecedented GPU scale and density,” said Greg Matson, SVP, Head of Products and Marketing, Solidigm. “By minimizing cooling infrastructure requirements, this technology helps to maximize compute deployments even in locations with limited physical footprint.”
Solidigm will also present March 18 at the GTC AI Conference on how optimized AI infrastructure requires the benefits provided from high-capacity SSDs. Training data sets are not new, but massive context windows, extended workflows, and rapid iteration are causing a data explosion on the inference side that analysts have dubbed the “memory wall.”
The solution: modern SSDs that are fast enough to relieve the pressure while also offering storage in the hundreds of terabytes, enabling unprecedented scale and efficiency.