Solidigm Extends eSSD Liquid Cooling Leadership at SC25

Solidigm is in St. Louis this week for SC25, sharing more on the company’s industry-leading efforts on enterprise SSD (eSSD) liquid cooling with a demonstration on immersion cooling.

At SC25, Solidigm advanced the industry’s liquid cooling agenda by demonstrating a flexible I/O tester (FIO)-based AI performance workload running on the Solidigm™ D5-P5430 E1.S  SSD. The demonstration connected the SSD to a server from Hypertec immersed in a tank from Midas with Valvoline fluid while monitoring the SSD SMART (Self-Monitoring, Analysis, and Reporting Technology) temperature.

Hypertec is developing high-density, immersion-born server systems aimed at AI/HPC/edge deployments, and the company collaborates closely with Midas Immersion Cooling that provides the ultra-dense immersion-tank infrastructure.

Next, Valvoline Global contributes advanced heat-transfer fluids engineered for immersion cooling. Valvoline has even been designated as a “technology affiliate” of Midas Immersion Cooling, meaning Valvoline’s fluids have passed Midas’s qualification for use in its systems.

Solidigm high-density eSSDs work seamlessly in this immersion solution packing up to 2 per unit in 1 per unit.

This cooling leadership demonstration follows Solidigm’s September introduction of the only Cold-Plate-Cooled eSSD for fully-fanless server configurations. The industry’s first eSSD with single-sided direct-to-chip liquid cooling technology, the Solidigm^TM  D7-PS1010 is one of the fastest PCIe 5.0 SSDs on the planet for Direct Attach Storage in GPU servers.